The reproducibility of qubit parameters is a challenge for scaling up superconducting quantum processors. Signal crosstalk imposes constraints on the frequency separation between neighboringqubits. The frequency uncertainty of transmon qubits arising from the fabrication process is attributed to deviations in the Josephson junction area, tunnel barrier thickness, and the qubit capacitor. We decrease the sensitivity to these variations by fabricating larger Josephson junctions and reduce the wafer-level standard deviation in resistance down to 2%. We characterize 32 identical transmon qubits and demonstrate the reproducibility of the qubit frequencies with a 40 MHz standard deviation (i.e. 1%) with qubit quality factors exceeding 2 million. We perform two-level-system (TLS) spectroscopy and observe no significant increase in the number of TLSs causing qubit relaxation. We further show by simulation that for our parametric-gate architecture, and accounting only for errors caused by the uncertainty of the qubit frequency, we can scale up to 100 qubits with an average of only 3 collisions between quantum-gate transition frequencies, assuming 2% crosstalk and 99.9% target gate fidelity.
High-fidelity and rapid readout of a qubit state is key to quantum computing and communication, and it is a prerequisite for quantum error correction. We present a readout scheme forsuperconducting qubits that combines two microwave techniques: applying a shelving technique to the qubit that effectively increases the energy-relaxation time, and a two-tone excitation of the readout resonator to distinguish among qubit populations in higher energy levels. Using a machine-learning algorithm to post-process the two-tone measurement results further improves the qubit-state assignment fidelity. We perform single-shot frequency-multiplexed qubit readout, with a 140ns readout time, and demonstrate 99.5% assignment fidelity for two-state readout and 96.9% for three-state readout – without using a quantum-limited amplifier.
We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips – one quantum chip and one control chip –that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90μs, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.