Graham Norris

Intermodulation Distortion in a Josephson Traveling Wave Parametric Amplifier

  1. Ants Remm,
  2. Sebastian Krinner,
  3. Nathan Lacroix,
  4. Christoph Hellings,
  5. Francois Swiadek,
  6. Graham Norris,
  7. Christopher Eichler,
  8. and Andreas Wallraff
Josephson traveling wave parametric amplifiers enable the amplification of weak microwave signals close to the quantum limit with large bandwidth, which has a broad range of applications
in superconducting quantum computing and in the operation of single-photon detectors. While the large bandwidth allows for their use in frequency-multiplexed detection architectures, an increased number of readout tones per amplifier puts more stringent requirements on the dynamic range to avoid saturation. Here, we characterize the undesired mixing processes between the different frequency-multiplexed tones applied to a Josephson traveling wave parametric amplifier, a phenomenon also known as intermodulation distortion. The effect becomes particularly significant when the amplifier is operated close to its saturation power. Furthermore, we demonstrate that intermodulation distortion can lead to significant crosstalk and reduction of fidelity for multiplexed readout of superconducting qubits. We suggest using large detunings between the pump and signal frequencies to mitigate crosstalk. Our work provides insights into the limitations of current Josephson traveling wave parametric amplifiers and highlights the importance of performing further research on these devices.
arxiv pdf

Building Blocks of a Flip-Chip Integrated Superconducting Quantum Processor

  1. Sandoko Kosen,
  2. Hang-Xi Li,
  3. Marcus Rommel,
  4. Daryoush Shiri,
  5. Christopher Warren,
  6. Leif Grönberg,
  7. Jaakko Salonen,
  8. Tahereh Abad,
  9. Janka Biznárová,
  10. Marco Caputo,
  11. Liangyu Chen,
  12. Kestutis Grigoras,
  13. Göran Johansson,
  14. Anton Frisk Kockum,
  15. Christian Križan,
  16. Daniel Pérez Lozano,
  17. Graham Norris,
  18. Amr Osman,
  19. Jorge Fernández-Pendás,
  20. Anita Fadavi Roudsari,
  21. Giovanna Tancredi,
  22. Andreas Wallraff,
  23. Christopher Eichler,
  24. Joonas Govenius,
  25. and Jonas Bylander
We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips – one quantum chip and one control chip –
that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90μs, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.
arxiv pdf