Dynamically Reconfigurable Photon Exchange in a Superconducting Quantum Processor

  1. Brian Marinelli,
  2. Jie Luo,
  3. Hengjiang Ren,
  4. Bethany M. Niedzielski,
  5. David K. Kim,
  6. Rabindra Das,
  7. Mollie Schwartz,
  8. David I. Santiago,
  9. and Irfan Siddiqi
Realizing the advantages of quantum computation requires access to the full Hilbert space of states of many quantum bits (qubits). Thus, large-scale quantum computation faces the challenge
of efficiently generating entanglement between many qubits. In systems with a limited number of direct connections between qubits, entanglement between non-nearest neighbor qubits is generated by a series of nearest neighbor gates, which exponentially suppresses the resulting fidelity. Here we propose and demonstrate a novel, on-chip photon exchange network. This photonic network is embedded in a superconducting quantum processor (QPU) to implement an arbitrarily reconfigurable qubit connectivity graph. We show long-range qubit-qubit interactions between qubits with a maximum spatial separation of 9.2 cm along a meandered bus resonator and achieve photon exchange rates up to gqq=2π×0.9 MHz. These experimental demonstrations provide a foundation to realize highly connected, reconfigurable quantum photonic networks and opens a new path towards modular quantum computing.

Hexagonal Boron Nitride (hBN) as a Low-loss Dielectric for Superconducting Quantum Circuits and Qubits

  1. Joel I.J. Wang,
  2. Megan A. Yamoah,
  3. Qing Li,
  4. Amir Karamlou,
  5. Thao Dinh,
  6. Bharath Kannan,
  7. Jochen Braumüller,
  8. David Kim,
  9. Alexander J. Melville,
  10. Sarah E. Muschinske,
  11. Bethany M. Niedzielski,
  12. Kyle Serniak,
  13. Youngkyu Sung,
  14. Roni Winik,
  15. Jonilyn L. Yoder,
  16. Mollie Schwartz,
  17. Kenji Watanabe,
  18. Takashi Taniguchi,
  19. Terry P. Orlando,
  20. Simon Gustavsson,
  21. Pablo Jarillo-Herrero,
  22. and William D. Oliver
Dielectrics with low loss at microwave frequencies are imperative for high-coherence solid-state quantum computing platforms. We study the dielectric loss of hexagonal boron nitride
(hBN) thin films in the microwave regime by measuring the quality factor of parallel-plate capacitors (PPCs) made of NbSe2-hBN-NbSe2 heterostructures integrated into superconducting circuits. The extracted microwave loss tangent of hBN is bounded to be at most in the mid-10-6 range in the low temperature, single-photon regime. We integrate hBN PPCs with aluminum Josephson junctions to realize transmon qubits with coherence times reaching 25 μs, consistent with the hBN loss tangent inferred from resonator measurements. The hBN PPC reduces the qubit feature size by approximately two-orders of magnitude compared to conventional all-aluminum coplanar transmons. Our results establish hBN as a promising dielectric for building high-coherence quantum circuits with substantially reduced footprint and, with a high energy participation that helps to reduce unwanted qubit cross-talk.

Quantum transport and localization in 1d and 2d tight-binding lattices

  1. Amir H. Karamlou,
  2. Jochen Braumüller,
  3. Yariv Yanay,
  4. Agustin Di Paolo,
  5. Patrick Harrington,
  6. Bharath Kannan,
  7. David Kim,
  8. Morten Kjaergaard,
  9. Alexander Melville,
  10. Sarah Muschinske,
  11. Bethany Niedzielski,
  12. Antti Vepsäläinen,
  13. Roni Winik,
  14. Jonilyn L. Yoder,
  15. Mollie Schwartz,
  16. Charles Tahan,
  17. Terry P. Orlando,
  18. Simon Gustavsson,
  19. and William D. Oliver
Particle transport and localization phenomena in condensed-matter systems can be modeled using a tight-binding lattice Hamiltonian. The ideal experimental emulation of such a model
utilizes simultaneous, high-fidelity control and readout of each lattice site in a highly coherent quantum system. Here, we experimentally study quantum transport in one-dimensional and two-dimensional tight-binding lattices, emulated by a fully controllable 3×3 array of superconducting qubits. We probe the propagation of entanglement throughout the lattice and extract the degree of localization in the Anderson and Wannier-Stark regimes in the presence of site-tunable disorder strengths and gradients. Our results are in quantitative agreement with numerical simulations and match theoretical predictions based on the tight-binding model. The demonstrated level of experimental control and accuracy in extracting the system observables of interest will enable the exploration of larger, interacting lattices where numerical simulations become intractable.

Fabrication of superconducting through-silicon vias

  1. Justin L. Mallek,
  2. Donna-Ruth W. Yost,
  3. Danna Rosenberg,
  4. Jonilyn L. Yoder,
  5. Gregory Calusine,
  6. Matt Cook,
  7. Rabindra Das,
  8. Alexandra Day,
  9. Evan Golden,
  10. David K. Kim,
  11. Jeffery Knecht,
  12. Bethany M. Niedzielski,
  13. Mollie Schwartz,
  14. Arjan Sevi,
  15. Corey Stull,
  16. Wayne Woods,
  17. Andrew J. Kerman,
  18. and William D. Oliver
Increasing circuit complexity within quantum systems based on superconducting qubits necessitates high connectivity while retaining qubit coherence. Classical micro-electronic systems
have addressed interconnect density challenges by using 3D integration with interposers containing through-silicon vias (TSVs), but extending these integration techniques to superconducting quantum systems is challenging. Here, we discuss our approach for realizing high-aspect-ratio superconducting TSVs\textemdash 10 μm wide by 20 μm long by 200 μm deep\textemdash with densities of 100 electrically isolated TSVs per square millimeter. We characterize the DC and microwave performance of superconducting TSVs at cryogenic temperatures and demonstrate superconducting critical currents greater than 20 mA. These high-aspect-ratio, high critical current superconducting TSVs will enable high-density vertical signal routing within superconducting quantum processors.