Roman Pilipenko

Systematic Improvements in Transmon Qubit Coherence Enabled by Niobium Surface Encapsulation

  1. Mustafa Bal,
  2. Akshay A. Murthy,
  3. Shaojiang Zhu,
  4. Francesco Crisa,
  5. Xinyuan You,
  6. Ziwen Huang,
  7. Tanay Roy,
  8. Jaeyel Lee,
  9. David van Zanten,
  10. Roman Pilipenko,
  11. Ivan Nekrashevich,
  12. Daniel Bafia,
  13. Yulia Krasnikova,
  14. Cameron J. Kopas,
  15. Ella O. Lachman,
  16. Duncan Miller,
  17. Josh Y. Mutus,
  18. Matthew J. Reagor,
  19. Hilal Cansizoglu,
  20. Jayss Marshall,
  21. David P. Pappas,
  22. Kim Vu,
  23. Kameshwar Yadavalli,
  24. Jin-Su Oh,
  25. Lin Zhou,
  26. Matthew J. Kramer,
  27. Dominic P. Goronzy,
  28. Carlos G. Torres-Castanedo,
  29. Graham Pritchard,
  30. Vinayak P. Dravid,
  31. James M. Rondinelli,
  32. Michael J. Bedzyk,
  33. Mark C. Hersam,
  34. John Zasadzinski,
  35. Jens Koch,
  36. James A. Sauls,
  37. Alexander Romanenko,
  38. and Anna Grassellino
We present a novel transmon qubit fabrication technique that yields systematic improvements in T1 coherence times. We fabricate devices using an encapsulation strategy that involves
passivating the surface of niobium and thereby preventing the formation of its lossy surface oxide. By maintaining the same superconducting metal and only varying the surface structure, this comparative investigation examining different capping materials and film substrates across different qubit foundries definitively demonstrates the detrimental impact that niobium oxides have on the coherence times of superconducting qubits, compared to native oxides of tantalum, aluminum or titanium nitride. Our surface-encapsulated niobium qubit devices exhibit T1 coherence times 2 to 5 times longer than baseline niobium qubit devices with native niobium oxides. When capping niobium with tantalum, we obtain median qubit lifetimes above 200 microseconds. Our comparative structural and chemical analysis suggests that amorphous niobium suboxides may induce higher losses. These results are in line with high-accuracy measurements of the niobium oxide loss tangent obtained with ultra-high Q superconducting radiofrequency (SRF) cavities. This new surface encapsulation strategy enables further reduction of dielectric losses via passivation with ambient-stable materials, while preserving fabrication and scalable manufacturability thanks to the compatibility with silicon processes.
arxiv pdf

Overlap junctions for superconducting quantum electronics and amplifiers

  1. Mustafa Bal,
  2. Junling Long,
  3. Ruichen Zhao,
  4. Haozhi Wang,
  5. Sungoh Park,
  6. Corey Rae Harrington McRae,
  7. Tongyu Zhao,
  8. Russell E. Lake,
  9. Daniil Frolov,
  10. Roman Pilipenko,
  11. Silvia Zorzetti,
  12. Alexander Romanenko,
  13. and David P. Pappas
Due to their unique properties as lossless, nonlinear circuit elements, Josephson junctions lie at the heart of superconducting quantum information processing. Previously, we demonstrated
a two-layer, submicrometer-scale overlap junction fabrication process suitable for qubits with long coherence times. Here, we extend the overlap junction fabrication process to micrometer-scale junctions. This allows us to fabricate other superconducting quantum devices. For example, we demonstrate an overlap-junction-based Josephson parametric amplifier that uses only 2 layers. This efficient fabrication process yields frequency-tunable devices with negligible insertion loss and a gain of ~ 30 dB. Compared to other processes, the overlap junction allows for fabrication with minimal infrastructure, high yield, and state-of-the-art device performance.
arxiv pdf