Entanglement Across Separate Silicon Dies in a Modular Superconducting Qubit Device

  1. Alysson Gold,
  2. JP Paquette,
  3. Anna Stockklauser,
  4. Matthew J. Reagor,
  5. M. Sohaib Alam,
  6. Andrew Bestwick,
  7. Nicolas Didier,
  8. Ani Nersisyan,
  9. Feyza Oruc,
  10. Armin Razavi,
  11. Ben Scharmann,
  12. Eyob A. Sete,
  13. Biswajit Sur,
  14. Davide Venturelli,
  15. Cody James Winkleblack,
  16. Filip Wudarski,
  17. Mike Harburn,
  18. and Chad Rigetti
Assembling future large-scale quantum computers out of smaller, specialized modules promises to simplify a number of formidable science and engineering challenges. One of the primary
challenges in developing a modular architecture is in engineering high fidelity, low-latency quantum interconnects between modules. Here we demonstrate a modular solid state architecture with deterministic inter-module coupling between four physically separate, interchangeable superconducting qubit integrated circuits, achieving two-qubit gate fidelities as high as 99.1±0.5\% and 98.3±0.3\% for iSWAP and CZ entangling gates, respectively. The quality of the inter-module entanglement is further confirmed by a demonstration of Bell-inequality violation for disjoint pairs of entangled qubits across the four separate silicon dies. Having proven out the fundamental building blocks, this work provides the technological foundations for a modular quantum processor: technology which will accelerate near-term experimental efforts and open up new paths to the fault-tolerant era for solid state qubit architectures.

Superconducting Through-Silicon Vias for Quantum Integrated Circuits

  1. Mehrnoosh Vahidpour,
  2. William O'Brien,
  3. Jon Tyler Whyland,
  4. Joel Angeles,
  5. Jayss Marshall,
  6. Diego Scarabelli,
  7. Genya Crossman,
  8. Kamal Yadav,
  9. Yuvraj Mohan,
  10. Catvu Bui,
  11. Vijay Rawat,
  12. Russ Renzas,
  13. Nagesh Vodrahalli,
  14. Andrew Bestwick,
  15. and Chad Rigetti
We describe a microfabrication process for superconducting through-silicon vias appropriate for use in superconducting qubit quantum processors. With a sloped-wall via geometry, we
can use non-conformal metal deposition methods such as electron-beam evaporation and sputtering, which reliably deposit high quality superconducting films. Via superconductivity is validated by demonstrating zero via-to-via resistance below the critical temperature of aluminum.

Superconducting Caps for Quantum Integrated Circuits

  1. William O'Brien,
  2. Mehrnoosh Vahidpour,
  3. Jon Tyler Whyland,
  4. Joel Angeles,
  5. Jayss Marshall,
  6. Diego Scarabelli,
  7. Genya Crossman,
  8. Kamal Yadav,
  9. Yuvraj Mohan,
  10. Catvu Bui,
  11. Vijay Rawat,
  12. Russ Renzas,
  13. Nagesh Vodrahalli,
  14. Andrew Bestwick,
  15. and Chad Rigetti
We report on the fabrication and metrology of superconducting caps for qubit circuits. As part of a 3D quantum integrated circuit architecture, a cap chip forms the upper half of an
enclosure that provides isolation, increases vacuum participation ratio, and improves performance of individual resonant elements. Here, we demonstrate that such caps can be reliably fabricated, placed on a circuit chip, and form superconducting connections to the circuit.

Analytical modeling of parametrically-modulated transmon qubits

  1. Nicolas Didier,
  2. Eyob A. Sete,
  3. Marcus P. da Silva,
  4. and Chad Rigetti
Scaling up quantum machines requires developing appropriate models to understand and verify their complex quantum dynamics. We focus on superconducting quantum processors based on transmons
for which full numerical simulations are already challenging at the level of qubytes. It is thus highly desirable to develop accurate methods of modeling qubit networks that do not rely solely on numerical computations. Using systematic perturbation theory to large orders in the transmon regime, we derive precise analytic expressions of the transmon parameters. We apply our results to the case of parametrically-modulated transmons to study recently-implemented parametrically-activated entangling gates.

Microwave-activated conditional-phase gate for superconducting qubits

  1. Jerry M. Chow,
  2. Jay M. Gambetta,
  3. Andrew W. Cross,
  4. Seth T. Merkel,
  5. Chad Rigetti,
  6. and M. Steffen
We introduce a new entangling gate between two fixed-frequency qubits statically coupled via a microwave resonator bus which combines the following desirable qualities: all-microwave
control, appreciable qubit separation for reduction of crosstalk and leakage errors, and the ability to function as a two-qubit conditional-phase gate. A fixed, always-on interaction is explicitly designed between higher energy (non-computational) states of two transmon qubits, and then a conditional-phase gate is `activated‘ on the otherwise unperturbed qubit subspace via a microwave drive. We implement this microwave-activated conditional-phase gate with a fidelity from quantum process tomography of 87%.

Characterization of addressability by simultaneous randomized benchmarking

  1. Jay M. Gambetta,
  2. A. D. Corcoles,
  3. S. T. Merkel,
  4. B. R. Johnson,
  5. John A. Smolin,
  6. Jerry M. Chow,
  7. Colm A. Ryan,
  8. Chad Rigetti,
  9. S. Poletto,
  10. Thomas A. Ohki,
  11. Mark B. Ketchen,
  12. and M. Steffen
The control and handling of errors arising from cross-talk and unwanted interactions in multi-qubit systems is an important issue in quantum information processing architectures. We
introduce a benchmarking protocol that provides information about the amount of addressability present in the system and implement it on coupled superconducting qubits. The protocol consists of randomized benchmarking each qubit individually and then simultaneously, and the amount of addressability is related to the difference of the average gate fidelities of those experiments. We present the results on two similar samples with different amounts of cross-talk and unwanted interactions, which agree with predictions based on simple models for the amount of residual coupling.

Superconducting qubit in waveguide cavity with coherence time approaching 0.1ms

  1. Chad Rigetti,
  2. Stefano Poletto,
  3. Jay M. Gambetta,
  4. B. L. T. Plourde,
  5. Jerry M. Chow,
  6. A. D. Corcoles,
  7. John A. Smolin,
  8. Seth T. Merkel,
  9. J. R. Rozen,
  10. George A. Keefe,
  11. Mary B. Rothwell,
  12. Mark B. Ketchen,
  13. and M. Steffen
We report a superconducting artificial atom with an observed quantum coherence time of T2*=95us and energy relaxation time T1=70us. The system consists of a single Josephson junction
transmon qubit embedded in an otherwise empty copper waveguide cavity whose lowest eigenmode is dispersively coupled to the qubit transition. We attribute the factor of four increase in the coherence quality factor relative to previous reports to device modifications aimed at reducing qubit dephasing from residual cavity photons. This simple device holds great promise as a robust and easily produced artificial quantum system whose intrinsic coherence properties are sufficient to allow tests of quantum error correction.