We use a floating tunable coupler to mediate interactions between qubits on separate chips to build a modular architecture. We demonstrate three different designs of multi-chip tunablecouplers using vacuum gap capacitors or superconducting indium bump bonds to connect the coupler to a microwave line on a common substrate and then connect to the qubit on the next chip. We show that the zero-coupling condition between qubits on separate chips can be achieved in each design and that the relaxation rates for the coupler and qubits are not noticeably affected by the extra circuit elements. Finally, we demonstrate two-qubit gate operations with fidelity at the same level as qubits with a tunable coupler on a single chip. Using one or more indium bonds does not degrade qubit coherence or impact the performance of two-qubit gates.
As the field of quantum computing progresses to larger-scale devices, multiplexing will be crucial to scale quantum processors. While multiplexed readout is common practice for superconductingdevices, relatively little work has been reported about the combination of flux and microwave control lines. Here, we present a method to integrate a microwave line and a flux line into a single „XYZ line“. This combined control line allows us to perform fast single-qubit gates as well as to deliver flux signals to the qubits. The measured relaxation times of the qubits are comparable to state-of-art devices employing separate control lines. We benchmark the fidelity of single-qubit gates with randomized benchmarking, achieving a fidelity above 99.5%, and we demonstrate that XYZ lines can in principle be used to run parametric entangling gates.
Assembling future large-scale quantum computers out of smaller, specialized modules promises to simplify a number of formidable science and engineering challenges. One of the primarychallenges in developing a modular architecture is in engineering high fidelity, low-latency quantum interconnects between modules. Here we demonstrate a modular solid state architecture with deterministic inter-module coupling between four physically separate, interchangeable superconducting qubit integrated circuits, achieving two-qubit gate fidelities as high as 99.1±0.5\% and 98.3±0.3\% for iSWAP and CZ entangling gates, respectively. The quality of the inter-module entanglement is further confirmed by a demonstration of Bell-inequality violation for disjoint pairs of entangled qubits across the four separate silicon dies. Having proven out the fundamental building blocks, this work provides the technological foundations for a modular quantum processor: technology which will accelerate near-term experimental efforts and open up new paths to the fault-tolerant era for solid state qubit architectures.