Scaling Alternating-Bias-Assisted Annealing for Precision Transmon Frequency Targeting on Superconducting Quantum Processors

  1. Xiqiao Wang,
  2. Mark Field,
  3. Teng Zhang,
  4. Xian Wu,
  5. Ferhat Aydinoglu,
  6. Joel Howard,
  7. Angela Q. Chen,
  8. Sara Elzeiny,
  9. Robert Smith,
  10. Timothy McSorley,
  11. Nicholas Sharac,
  12. Eyob Sete,
  13. Alysson Gold,
  14. Hilal Cansizoglu,
  15. Greg Stiehl,
  16. Josh Mutus,
  17. Kameshwar Yadavalli,
  18. Andrew Bestwick,
  19. Stefano Poletto,
  20. Raja Katta,
  21. and David P. Pappas
Recent advances in the alternating-bias-assisted annealing (ABAA) technique have successfully mitigated intrinsic Josephson-junction (JJ) fabrication variations. This new technique
enables precision qubit frequency tuning alongside simplicity. However, it is critical to enhance tuning throughput and yield while investigating the factors that drive targeting performance as the technology scales. Here, we characterize ABAA tuning performance within a 150-mm wafer process flow and extend this technique to simultaneous, multi-channel tuning, demonstrating that a wafer-scale JJ resistance tuning precision of σ=0.50±0.05% alongside a component-level yield of ≥98.8% can be achieved. Furthermore, we demonstrate a strong correlation between yield, tuning speed, and junction breakdown voltage, establishing the latter as a vital process control parameter for meeting production goals. Finally, we demonstrate a successful implementation of ABAA tuning on a quad-module quantum processor (Rigetti Cepheus-1-36Q), where we achieve an empirical frequency targeting precision of σ∼30 MHz in both qubit and qubit-qubit detuning frequencies, contributing to high median two-qubit gate fidelities. These results confirm the efficacy and scalability of ABAA for high-precision Hamiltonian targeting, a critical enabler for modular superconducting quantum processor technology.

Entanglement Across Separate Silicon Dies in a Modular Superconducting Qubit Device

  1. Alysson Gold,
  2. JP Paquette,
  3. Anna Stockklauser,
  4. Matthew J. Reagor,
  5. M. Sohaib Alam,
  6. Andrew Bestwick,
  7. Nicolas Didier,
  8. Ani Nersisyan,
  9. Feyza Oruc,
  10. Armin Razavi,
  11. Ben Scharmann,
  12. Eyob A. Sete,
  13. Biswajit Sur,
  14. Davide Venturelli,
  15. Cody James Winkleblack,
  16. Filip Wudarski,
  17. Mike Harburn,
  18. and Chad Rigetti
Assembling future large-scale quantum computers out of smaller, specialized modules promises to simplify a number of formidable science and engineering challenges. One of the primary
challenges in developing a modular architecture is in engineering high fidelity, low-latency quantum interconnects between modules. Here we demonstrate a modular solid state architecture with deterministic inter-module coupling between four physically separate, interchangeable superconducting qubit integrated circuits, achieving two-qubit gate fidelities as high as 99.1±0.5\% and 98.3±0.3\% for iSWAP and CZ entangling gates, respectively. The quality of the inter-module entanglement is further confirmed by a demonstration of Bell-inequality violation for disjoint pairs of entangled qubits across the four separate silicon dies. Having proven out the fundamental building blocks, this work provides the technological foundations for a modular quantum processor: technology which will accelerate near-term experimental efforts and open up new paths to the fault-tolerant era for solid state qubit architectures.