Superconducting qubits in today’s quantum processing units are typically fabricated with angle-evaporated aluminum–aluminum-oxide–aluminum Josephson junctions. However,there is an urgent need to overcome the limited reproducibility of this approach when scaling up the number of qubits and junctions. Fabrication methods based on subtractive patterning of superconductor–insulator–superconductor trilayers, used for more classical large-scale Josephson junction circuits, could provide the solution but they in turn often suffer from lossy dielectrics incompatible with high qubit coherence. In this work, we utilize native aluminum oxide as a sidewall passivation layer for junctions based on aluminum–aluminum-oxide–niobium trilayers, and use such junctions in qubits. We design the fabrication process such that the few-nanometer-thin native oxide is not exposed to oxide removal steps that could increase its defect density or hinder its ability to prevent shorting between the leads of the junction. With these junctions, we design and fabricate transmon-like qubits and measure time-averaged coherence times up to 30 μs at a qubit frequency of 5 GHz, corresponding to a qubit quality factor of one million. Our process uses subtractive patterning and optical lithography on wafer scale, enabling high throughput in patterning. This approach provides a scalable path toward fabrication of superconducting qubits on industry-standard platforms.
Cryogenic microsystems that utilize different 3D integration techniques are being actively developed, e.g., for the needs of quantum technologies. 3D integration can introduce opportunitiesand challenges to the thermal management of low temperature devices. In this work, we investigate sub-1 K inter-chip thermal resistance of a flip-chip bonded assembly, where two silicon chips are interconnected by indium bumps by atmospheric thermocompression bonding. The temperature dependence of the inter-chip thermal resistance follows the power law of αT−3, with α=7.7−15.4 K4 μm2/nW and a thermal contact area of 0.306 mm2. The T−3 relation indicates phononic interfacial thermal resistance, which is supported by the vanishing electrical thermal conduction due to the superconducting interconnections. Such a thermal resistance value can introduce a thermalization bottleneck, which can be detrimental for some applications, but it can also be harnessed. We provide a study of the latter case by simulating the performance of solid-state junction microrefrigerator where we use the measured thermal resistance value.
The field of propagating quantum microwaves has started to receive considerable attention in the past few years. Motivated at first by the lack of an efficient microwave-to-opticalplatform that could solve the issue of secure communication between remote superconducting chips, current efforts are starting to reach other areas, from quantum communications to sensing. Here, we attempt at giving a state-of-the-art view of the two, pointing at some of the technical and theoretical challenges we need to address, and while providing some novel ideas and directions for future research. Hence, the goal of this paper is to provide a bigger picture, and — we hope — to inspire new ideas in quantum communications and sensing: from open-air microwave quantum key distribution to direct detection of dark matter, we expect that the recent efforts and results in quantum microwaves will soon attract a wider audience, not only in the academic community, but also in an industrial environment.