Identifying Materials-Level Sources of Performance Variation in Superconducting Transmon Qubits

  1. Akshay A. Murthy,
  2. Mustafa Bal,
  3. Michael J. Bedzyk,
  4. Hilal Cansizoglu,
  5. Randall K. Chan,
  6. Venkat Chandrasekhar,
  7. Francesco Crisa,
  8. Amlan Datta,
  9. Yanpei Deng,
  10. Celeo D. Matute Diaz,
  11. Vinayak P. Dravid,
  12. David A. Garcia-Wetten,
  13. Sabrina Garattoni,
  14. Sunil Ghimire,
  15. Dominic P. Goronzy,
  16. Sebastian de Graaf,
  17. Sam Haeuser,
  18. Mark C. Hersam,
  19. Dieter Isheim,
  20. Kamal Joshi,
  21. Richard Kim,
  22. Saagar Kolachina,
  23. Cameron J. Kopas,
  24. Matthew J. Kramer,
  25. Ella O. Lachman,
  26. Jaeyel Lee,
  27. Peter G. Lim,
  28. Andrei Lunin,
  29. William Mah,
  30. Jayss Marshall,
  31. Josh Y. Mutus,
  32. Jin-Su Oh,
  33. David Olaya,
  34. David P. Pappas,
  35. Joong-mok Park,
  36. Ruslan Prozorov,
  37. Roberto dos Reis,
  38. David N. Seidman,
  39. Zuhawn Sung,
  40. Makariy Tanatar,
  41. Mitchell J. Walker,
  42. Jigang Wang,
  43. Haotian Wu,
  44. Lin Zhou,
  45. Shaojiang Zhu,
  46. Anna Grassellino,
  47. and Alexander Romanenko
The Superconducting Materials and Systems (SQMS) Center, a DOE National Quantum Information Science Research Center, has conducted a comprehensive and coordinated study using superconducting
transmon qubit chips with known performance metrics to identify the underlying materials-level sources of device-to-device performance variation. Following qubit coherence measurements, these qubits of varying base superconducting metals and substrates have been examined with various nondestructive and invasive material characterization techniques at Northwestern University, Ames National Laboratory, and Fermilab as part of a blind study. We find trends in variations of the depth of the etched substrate trench, the thickness of the surface oxide, and the geometry of the sidewall, which when combined, lead to correlations with the T1 lifetime across different devices. In addition, we provide a list of features that varied from device to device, for which the impact on performance requires further studies. Finally, we identify two low-temperature characterization techniques that may potentially serve as proxy tools for qubit measurements. These insights provide materials-oriented solutions to not only reduce performance variations across neighboring devices, but also to engineer and fabricate devices with optimal geometries to achieve performance metrics beyond the state-of-the-art values.

Systematic Improvements in Transmon Qubit Coherence Enabled by Niobium Surface Encapsulation

  1. Mustafa Bal,
  2. Akshay A. Murthy,
  3. Shaojiang Zhu,
  4. Francesco Crisa,
  5. Xinyuan You,
  6. Ziwen Huang,
  7. Tanay Roy,
  8. Jaeyel Lee,
  9. David van Zanten,
  10. Roman Pilipenko,
  11. Ivan Nekrashevich,
  12. Daniel Bafia,
  13. Yulia Krasnikova,
  14. Cameron J. Kopas,
  15. Ella O. Lachman,
  16. Duncan Miller,
  17. Josh Y. Mutus,
  18. Matthew J. Reagor,
  19. Hilal Cansizoglu,
  20. Jayss Marshall,
  21. David P. Pappas,
  22. Kim Vu,
  23. Kameshwar Yadavalli,
  24. Jin-Su Oh,
  25. Lin Zhou,
  26. Matthew J. Kramer,
  27. Dominic P. Goronzy,
  28. Carlos G. Torres-Castanedo,
  29. Graham Pritchard,
  30. Vinayak P. Dravid,
  31. James M. Rondinelli,
  32. Michael J. Bedzyk,
  33. Mark C. Hersam,
  34. John Zasadzinski,
  35. Jens Koch,
  36. James A. Sauls,
  37. Alexander Romanenko,
  38. and Anna Grassellino
We present a novel transmon qubit fabrication technique that yields systematic improvements in T1 coherence times. We fabricate devices using an encapsulation strategy that involves
passivating the surface of niobium and thereby preventing the formation of its lossy surface oxide. By maintaining the same superconducting metal and only varying the surface structure, this comparative investigation examining different capping materials and film substrates across different qubit foundries definitively demonstrates the detrimental impact that niobium oxides have on the coherence times of superconducting qubits, compared to native oxides of tantalum, aluminum or titanium nitride. Our surface-encapsulated niobium qubit devices exhibit T1 coherence times 2 to 5 times longer than baseline niobium qubit devices with native niobium oxides. When capping niobium with tantalum, we obtain median qubit lifetimes above 200 microseconds. Our comparative structural and chemical analysis suggests that amorphous niobium suboxides may induce higher losses. These results are in line with high-accuracy measurements of the niobium oxide loss tangent obtained with ultra-high Q superconducting radiofrequency (SRF) cavities. This new surface encapsulation strategy enables further reduction of dielectric losses via passivation with ambient-stable materials, while preserving fabrication and scalable manufacturability thanks to the compatibility with silicon processes.