Native-oxide-passivated trilayer junctions for superconducting qubits

  1. Pankaj Sethi,
  2. Om Prakash,
  3. Jukka-Pekka Kaikkonen,
  4. Mikael Kervinen,
  5. Elsa T. Mannila,
  6. Mário Ribeiro,
  7. Debopam Datta,
  8. Christopher W. Förbom,
  9. Jorden Senior,
  10. Renan P. Loreto,
  11. Joel Hätinen,
  12. Klaara Viisanen,
  13. Jukka I. Väyrynen,
  14. Alberto Ronzani,
  15. Antti Kemppinen,
  16. Visa Vesterinen,
  17. Mika Prunnila,
  18. and Joonas Govenius
Superconducting qubits in today’s quantum processing units are typically fabricated with angle-evaporated aluminum–aluminum-oxide–aluminum Josephson junctions. However,
there is an urgent need to overcome the limited reproducibility of this approach when scaling up the number of qubits and junctions. Fabrication methods based on subtractive patterning of superconductor–insulator–superconductor trilayers, used for more classical large-scale Josephson junction circuits, could provide the solution but they in turn often suffer from lossy dielectrics incompatible with high qubit coherence. In this work, we utilize native aluminum oxide as a sidewall passivation layer for junctions based on aluminum–aluminum-oxide–niobium trilayers, and use such junctions in qubits. We design the fabrication process such that the few-nanometer-thin native oxide is not exposed to oxide removal steps that could increase its defect density or hinder its ability to prevent shorting between the leads of the junction. With these junctions, we design and fabricate transmon-like qubits and measure time-averaged coherence times up to 30 μs at a qubit frequency of 5 GHz, corresponding to a qubit quality factor of one million. Our process uses subtractive patterning and optical lithography on wafer scale, enabling high throughput in patterning. This approach provides a scalable path toward fabrication of superconducting qubits on industry-standard platforms.

Heat rectification via a superconducting artificial atom

  1. Jorden Senior,
  2. Azat Gubaydullin,
  3. Bayan Karimi,
  4. Joonas T. Peltonen,
  5. Joachim Ankerhold,
  6. and Jukka P. Pekola
In miniaturising electrical devices down to nanoscales, heat transfer has turned into a serious obstacle but also potential resource for future developments, both for conventional and
quantum computing architectures. Controlling heat transport in superconducting circuits has thus received increasing attention in engineering microwave environments for circuit quantum electrodynamics (cQED) and circuit quantum thermodynamics experiments (cQTD). While theoretical proposals for cQTD devices are numerous, the experimental situation is much less advanced. There exist only relatively few experimental realisations, mostly due to the difficulties in developing the hybrid devices and in interfacing these often technologically contrasting components. Here we show a realisation of a quantum heat rectifier, a thermal equivalent to the electronic diode, utilising a superconducting transmon qubit coupled to two strongly unequal resonators terminated by mesoscopic heat baths. Our work is the experimental realisation of the spin-boson rectifier proposed by Segal and Nitzan.

Characterizing Low-Quality-Factor Dissipative Superconducting Resonators

  1. Yu-Cheng Chang,
  2. Bayan Karimi,
  3. Jorden Senior,
  4. Alberto Ronzani,
  5. Joonas T. Peltonen,
  6. Hsi-Sheng Goan,
  7. Chii-Dong Chen,
  8. and Jukka P. Pekola
Characterizing superconducting microwave resonators with highly dissipative elements is a technical challenge, but a requirement for implementing and understanding the operation of
hybrid quantum devices involving dissipative elements, e.g. for thermal engineering and detection. We present experiments on λ/4 superconducting niobium coplanar waveguide (CPW) resonators, shunted at the antinode by a dissipative copper microstrip via aluminium leads, yielding a quality factor unresolvable from the typical microwave environment. By measuring the transmission both above and below this transition, we are able to isolate the resonance. We then experimentally verify this method with copper microstrips of increasing thicknesses, from 50 nm to 150 nm, and measure quality factors in the range of 10∼67 in a consistent way.