Direct Implementation of High-Fidelity Three-Qubit Gates for Superconducting Processor with Tunable Couplers

  1. Hao-Tian Liu,
  2. Bing-Jie Chen,
  3. Jia-Chi Zhang,
  4. Yong-Xi Xiao,
  5. Tian-Ming Li,
  6. Kaixuan Huang,
  7. Ziting Wang,
  8. Hao Li,
  9. Kui Zhao,
  10. Yueshan Xu,
  11. Cheng-Lin Deng,
  12. Gui-Han Liang,
  13. Zheng-He Liu,
  14. Si-Yun Zhou,
  15. Cai-Ping Fang,
  16. Xiaohui Song,
  17. Zhongcheng Xiang,
  18. Dongning Zheng,
  19. Yun-Hao Shi,
  20. Kai Xu,
  21. and Heng Fan
Three-qubit gates can be constructed using combinations of single-qubit and two-qubit gates, making their independent realization unnecessary. However, direct implementation of three-qubit
gates reduces the depth of quantum circuits, streamlines quantum programming, and facilitates efficient circuit optimization, thereby enhancing overall performance in quantum computation. In this work, we propose and experimentally demonstrate a high-fidelity scheme for implementing a three-qubit controlled-controlled-Z (CCZ) gate in a flip-chip superconducting quantum processor with tunable couplers. This direct CCZ gate is implemented by simultaneously leveraging two tunable couplers interspersed between three qubits to enable three-qubit interactions, achieving an average final state fidelity of 97.94% and a process fidelity of 93.54%. This high fidelity cannot be achieved through a simple combination of single- and two-qubit gate sequences from processors with similar performance levels. Our experiments also verify that multi-layer direct implementation of the CCZ gate exhibits lower leakage compared to decomposed gate approaches. To further showcase the versatility of our approach, we construct a Toffoli gate by combining the CCZ gate with Hadamard gates. As a showcase, we utilize the CCZ gate as an oracle to implement the Grover search algorithm on three qubits, demonstrating high performance with the target probability amplitude significantly enhanced after two iterations. These results highlight the advantage of our approach, and facilitate the implementation of complex quantum circuits.

Vacuum-gap transmon qubits realized using flip-chip technology

  1. Xuegang Li,
  2. Yingshan Zhang,
  3. Chuhong Yang,
  4. Zhiyuan Li,
  5. Junhua Wang,
  6. Tang Su,
  7. Mo Chen,
  8. Yongchao Li,
  9. Chengyao Li,
  10. Zhenyu Mi,
  11. Xuehui Liang,
  12. Chenlu Wang,
  13. Zhen Yang,
  14. Yulong Feng,
  15. Kehuan Linghu,
  16. Huikai Xu,
  17. Jiaxiu Han,
  18. Weiyang Liu,
  19. Peng Zhao,
  20. Teng Ma,
  21. Ruixia Wang,
  22. Jingning Zhang,
  23. Yu Song,
  24. Pei Liu,
  25. Ziting Wang,
  26. Zhaohua Yang,
  27. Guangming Xue,
  28. Yirong Jin,
  29. and Haifeng Yu
Significant progress has been made in building large-scale superconducting quantum processors based on flip-chip technology. In this work, we use the flip-chip technology to realize
a modified transmon qubit, donated as the „flipmon“, whose large shunt capacitor is replaced by a vacuum-gap parallel plate capacitor. To further reduce the qubit footprint, we place one of the qubit pads and a single Josephson junction on the bottom chip and the other pad on the top chip which is galvanically connected with the single Josephson junction through an indium bump. The electric field participation ratio can arrive at nearly 53% in air when the vacuum-gap is about 5 microns, and thus potentially leading to a lower dielectric loss. The coherence times of the flipmons are measured in the range of 30-60 microseconds, which are comparable with that of traditional transmons with similar fabrication processes. The electric field simulation indicates that the metal-air interface’s participation ratio increases significantly and may dominate the qubit’s decoherence. This suggests that more careful surface treatment needs to be considered. No evidence shows that the indium bumps inside the flipmons cause significant decoherence. With well-designed geometry and good surface treatment, the coherence of the flipmons can be further improved.