Lumped-element inductors are an integral component in the circuit QED toolbox. However, it is challenging to build inductors that are simultaneously compact, linear and low-loss withstandard approaches that either rely on the geometric inductance of superconducting thin films or on the kinetic inductance of Josephson junctions arrays. In this work, we overcome this challenge by utilizing the high kinetic inductance offered by superconducting granular aluminum (grAl). We demonstrate lumped-element inductors with a few nH of inductance that are up to 100 times more compact than inductors built from pure aluminum (Al). To characterize the properties of these linear inductors, we first report on the performance of lumped-element resonators built entirely out of grAl with sheet inductances varying from 30−320pH/sq and self-Kerr non-linearities of 0.2−20Hz/photon. Further, we demonstrate ex-situ integration of these grAl inductors into hybrid resonators with Al or tantalum (Ta) capacitor electrodes without increasing total internal losses. Interestingly, the measured internal quality factors systematically decrease with increasing room-temperature resistivity of the grAl film for all devices, indicating a trade-off between compactness and internal loss. For our lowest resistivity grAl films, we measure quality factors reaching 3.5×106 for the all-grAl devices and 4.5×106 for the hybrid grAl/Ta devices, similar to state-of-the-art quantum circuits. Our loss analysis suggests that the surface loss factor of grAl is similar to that of pure Al for our lowest resistivity films, while the increasing losses with resistivity could be explained by increasing conductor loss in the grAl film.
Bosonic codes offer a hardware-efficient strategy for quantum error correction by redundantly encoding quantum information in the large Hilbert space of a harmonic oscillator. However,experimental realizations of these codes are often limited by ancilla errors propagating to the encoded logical qubit during syndrome measurements. The Kerr-cat qubit has been proposed as an ancilla for these codes due to its theoretically-exponential noise bias, which would enable fault-tolerant error syndrome measurements, but the coupling required to perform these syndrome measurements has not yet been demonstrated. In this work, we experimentally realize driven parametric coupling of a Kerr-cat qubit to a high-quality-factor microwave cavity and demonstrate a gate set enabling universal quantum control of the cavity. We measure the decoherence of the cavity in the presence of the Kerr-cat and discover excess dephasing due to heating of the Kerr-cat to excited states. By engineering frequency-selective dissipation to counteract this heating, we are able to eliminate this dephasing, thereby demonstrating a high on-off ratio of control. Our results pave the way toward using the Kerr-cat to fault-tolerantly measure error syndromes of bosonic codes.
Fast, high-fidelity operations between microwave resonators are an important tool for bosonic quantum computation and simulation with superconducting circuits. An attractive approachfor implementing these operations is to couple these resonators via a nonlinear converter and actuate parametric processes with RF drives. It can be challenging to make these processes simultaneously fast and high fidelity, since this requires introducing strong drives without activating parasitic processes or introducing additional decoherence channels. We show that in addition to a careful management of drive frequencies and the spectrum of environmental noise, leveraging the inbuilt symmetries of the converter Hamiltonian can suppress unwanted nonlinear interactions, preventing converter-induced decoherence. We demonstrate these principles using a differentially-driven DC-SQUID as our converter, coupled to two high-Q microwave cavities. Using this architecture, we engineer a highly-coherent beamsplitter and fast (∼ 100 ns) swaps between the cavities, limited primarily by their intrinsic single-photon loss. We characterize this beamsplitter in the cavities‘ joint single-photon subspace, and show that we can detect and post-select photon loss events to achieve a beamsplitter gate fidelity exceeding 99.98%, which to our knowledge far surpasses the current state of the art.
Dielectric loss is known to limit state-of-the-art superconducting qubit lifetimes. Recent experiments imply upper bounds on bulk dielectric loss tangents on the order of 100 parts-per-billion,but because these inferences are drawn from fully fabricated devices with many loss channels, they do not definitively implicate or exonerate the dielectric. To resolve this ambiguity, we have devised a measurement method capable of separating and resolving bulk dielectric loss with a sensitivity at the level of 5 parts-per-billion. The method, which we call the dielectric dipper, involves the in-situ insertion of a dielectric sample into a high-quality microwave cavity mode. Smoothly varying the sample’s participation in the cavity mode enables a differential measurement of the sample’s dielectric loss tangent. The dielectric dipper can probe the low-power behavior of dielectrics at cryogenic temperatures, and does so without the need for any lithographic process, enabling controlled comparisons of substrate materials and processing techniques. We demonstrate the method with measurements of EFG sapphire, from which we infer a bulk loss tangent of 62(7)×10−9 and a substrate-air interface loss tangent of 12(2)×10−4. For a typical transmon, this bulk loss tangent would limit device quality factors to less than 20 million, suggesting that bulk loss is likely the dominant loss mechanism in the longest-lived transmons on sapphire. We also demonstrate this method on HEMEX sapphire and bound its bulk loss tangent to be less than 15(5)×10−9. As this bound is about four times smaller than the bulk loss tangent of EFG sapphire, use of HEMEX sapphire as a substrate would lift the bulk dielectric coherence limit of a typical transmon qubit to several milliseconds.
Low-loss cavities are important in building high-coherence superconducting quantum computers. Generating high quality joints between parts is crucial to the realization of a scalablequantum computer using the circuit quantum electrodynamics (cQED) framework. In this paper, we adapt the technique of indium bump bonding to the cQED architecture to realize high quality superconducting microwave joints between chips. We use this technique to fabricate compact superconducting cavities in the multilayer microwave integrated quantum circuits (MMIQC) architecture and achieve single photon quality factor over 300 million or single-photon lifetimes approaching 5 ms. To quantify the performance of the resulting seam, we fabricate microwave stripline resonators in multiple sections connected by different numbers of bonds, resulting in a wide range of seam admittances. The measured quality factors combined with the designed seam admittances allow us to bound the conductance of the seam at gseam≥2×1010/(Ωm). Such a conductance should enable construction of micromachined superconducting cavities with quality factor of at least a billion. These results demonstrate the capability to construct very high quality microwave structures within the MMIQC architecture.