We have been developing a ten-superconductor-layer planarized fabrication process with NbN kinetic inductors and searching for suitable self-shunted JJs to potentially replace high Josephson critical current density, Jc, Nb/Al-AlOx/Nb junctions. We report on the fabrication and electrical properties of NbN/NbNx/NbN junctions produced by reactive sputtering in Ar+N2 mixture on 200-mm wafers at 200 oC and incorporated into a planarized process with two Nb ground planes and Nb wiring layer. Here NbN is a stoichiometric nitride with superconducting critical temperature Tc =15 K and NbNx is a high resistivity, nonsuperconducting nitride deposited using a higher nitrogen partial pressure than for the NbN electrodes. For comparison, we co-fabricated Nb/NbNx/Nb JJs using the same NbNx barriers deposited at 20 oC. We varied the NbNx barrier thickness from 5 nm to 20 nm, resulting in the range of Jc from about 1 mA/um^2 down to ~10 uA/um^2, and extracted coherence length of 3 nm and 4 nm in NbNx deposited, respectively at 20 oC and 200 oC. Both types of JJs are well described by resistively and capacitively shunted junction model without any excess current. We found the Jc of NbN/NbNx/NbN JJs to be somewhat lower than of Nb/NbNx/Nb JJs with the same barrier thickness, despite a much higher Tc and energy gap of NbN than of Nb electrodes. IcRn products up to ~ 0.5 mV were obtained for JJs with Jc~ 0.6 mA/um^2. Jc(T) dependences have been measured.