Laurent Michaud

Mitigating Losses of Superconducting Qubits Strongly Coupled to Defect Modes

  1. Dante Colao Zanuz,
  2. Quentin Ficheux,
  3. Laurent Michaud,
  4. Alexei Orekhov,
  5. Kilian Hanke,
  6. Alexander Flasby,
  7. Mohsen Bahrami Panah,
  8. Graham J. Norris,
  9. Michael Kerschbaum,
  10. Ants Remm,
  11. François Swiadek,
  12. Christoph Hellings,
  13. Stefania Lazăr,
  14. Colin Scarato,
  15. Nathan Lacroix,
  16. Sebastian Krinner,
  17. Christopher Eichler,
  18. Andreas Wallraff,
  19. and Jean-Claude Besse
The dominant contribution to the energy relaxation of state-of-the-art superconducting qubits is often attributed to their coupling to an ensemble of material defects which behave as
two-level systems. These defects have varying microscopic characteristics which result in a large range of observable defect properties such as resonant frequencies, coherence times and coupling rates to qubits g. Here, we investigate strategies to mitigate losses to the family of defects that strongly couple to qubits (g/2π≥ 0.5 MHz). Such strongly coupled defects are particularly detrimental to the coherence of qubits and to the fidelities of operations relying on frequency excursions, such as flux-activated two-qubit gates. To assess their impact, we perform swap spectroscopy on 92 frequency-tunable qubits and quantify the spectral density of these strongly coupled modes. We show that the frequency configuration of the defects is rearranged by warming up the sample to room temperature, whereas the total number of defects on a processor tends to remain constant. We then explore methods for fabricating qubits with a reduced number of strongly coupled defect modes by systematically measuring their spectral density for decreasing Josephson junction dimensions and for various surface cleaning methods. Our results provide insights into the properties of strongly coupled defect modes and show the benefits of minimizing Josephson junction dimensions to improve qubit properties.
arxiv pdf

Improved Parameter Targeting in {3D}-Integrated Superconducting Circuits through a Polymer Spacer Process

  1. Graham J. Norris,
  2. Laurent Michaud,
  3. David Pahl,
  4. Michael Kerschbaum,
  5. Christopher Eichler,
  6. Jean-Claude Besse,
  7. and Andreas Wallraff
Three-dimensional device integration facilitates the construction of superconducting quantum information processors with more than several tens of qubits by distributing elements such
as control wires, qubits, and resonators between multiple layers. The frequencies of resonators and qubits in flip-chip-bonded multi-chip modules depend on the details of their electromagnetic environment defined by the conductors and dielectrics in their vicinity. Accurate frequency targeting therefore requires precise control of the separation between chips and minimization of their relative tilt. Here, we describe a method to control the inter-chip separation by using polymer spacers. Compared to an identical process without spacers, we reduce the measured planarity error by a factor of 3.5, to a mean tilt of 76(35) μrad, and the deviation from the target inter-chip separation by a factor of ten, to a mean of 0.4(8) μm. We apply this process to coplanar waveguide resonator samples and observe chip-to-chip resonator frequency variations below 50 MHz (≈ 1 %). We measure internal quality factors of 5×105 at the single-photon level, suggesting that the added spacers are compatible with low-loss device fabrication.
arxiv pdf