As the field of superconducting quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3Dintegration and packaging. While 3D integration is well-developed for commercial electronics, relatively little work has been performed to determine its compatibility with high-coherence solid-state qubits. Of particular concern, qubit coherence times can be suppressed by the requisite processing steps and close proximity of another chip. In this work, we use a flip-chip process to bond a chip with superconducting flux qubits to another chip containing structures for qubit readout and control. We demonstrate that high qubit coherence (T1, T2,echo>20μs) is maintained in a flip-chip geometry in the presence of galvanic, capacitive, and inductive coupling between the chips.
The scalable application of quantum information science will stand on reproducible and controllable high-coherence quantum bits (qubits). In this work, we revisit the design and fabricationof the superconducting flux qubit, achieving a planar device with broad frequency tunability, strong anharmonicity, high reproducibility, and coherence times in excess of 40 us at its flux-insensitive point. Qubit relaxation times across 21 qubits of widely varying designs are consistently matched with a single model involving ohmic charge noise, quasiparticle fluctuations, resonator loss, and 1/f flux noise, a noise source previously considered primarily in the context of dephasing. We furthermore demonstrate that qubit dephasing at the flux-insensitive point is dominated by residual thermal photons in the readout resonator. The resulting photon shot noise is mitigated using a dynamical decoupling protocol, reaching T2 ~ 80 us , approximately the 2T1 limit. In addition to realizing a dramatically improved flux qubit, our results uniquely identify photon shot noise as limiting T2 in contemporary state-of-art qubits based on transverse qubit-resonator interaction.