techniques to reduce dielectric loss contributions from the superconducting film interfaces. In recent years, however, sub-micron scale overlap junctions have started to attract attention. Compared to shadow mask techniques, neither an angle dependent deposition nor free-standing bridges or overlaps are needed, which are significant limitations for wafer-scale processing. This comes at the cost of breaking the vacuum during fabrication, but simplifies integration in multi-layered circuits, implementation of vastly different junction sizes, and enables fabrication on a larger scale in an industrially-standardized process. In this work, we demonstrate the feasibility of a subtractive process for fabrication of overlap junctions. We evaluate the coherence properties of the junctions by employing them in superconducting transmon qubits. In time domain experiments, we find that both, the qubit life- and coherence time of our best device, are on average greater than 20 μs. Finally, we discuss potential improvements to our technique. This work paves the way towards a more standardized process flow with advanced materials and growth processes, and constitutes an important step for large scale fabrication of superconducting quantum circuits.