structural elements: \textit{airbridges} to connect non-adjacent elements in the base layer, and \textit{bandages} to connect the electrodes forming the Josephson junctions to the base layer. Bandages introduce unwanted parasitic material interfaces and increase the manufacturing complexity. Here, we overcome the limitations imposed by \emph{bandages} by establishing \textit{all} electrical interconnects with airbridges of varying size fabricated in a single step. The airbridges show a high yield and mechanical stability over a wide range of sizes from 0.5μm to 4μm in width and from 5μm to 40μm in length, and show low loss when integrated in coplanar waveguide resonators and transmon qubits. Measured relaxation times up to more than 250μs in standard transmon geometries show that the process achieves high coherence while substantially easing and accelerating device fabrication.