Tantalum airbridges for scalable superconducting quantum processors

  1. Kunliang Bu,
  2. Sainan Huai,
  3. Zhenxing Zhang,
  4. Dengfeng Li,
  5. Yuan Li,
  6. Jingjing Hu,
  7. Xiaopei Yang,
  8. Maochun Dai,
  9. Tianqi Cai,
  10. Yi-Cong Zheng,
  11. and Shengyu Zhang
The unique property of tantalum (Ta), particularly its long coherent lifetime in superconducting qubits and its exceptional resistance to both acid and alkali, makes it promising for
superconducting quantum processors. It is a notable advantage to achieve high-performance quantum processors with neat and unified fabrication of all circuit elements, including coplanar waveguides (CPW), qubits, and airbridges, on the tantalum film-based platform. Here, we propose a reliable tantalum airbridges with separate or fully-capped structure fabricated via a novel lift-off method, where a barrier layer with aluminium (Al) film is first introduced to separate two layers of photoresist and then etched away before the deposition of tantalum film, followed by cleaning with piranha solution to remove the residual photoresist on the chip. We characterize such tantalum airbridges as the control line jumpers, the ground plane crossovers and even coupling elements. They exhibit excellent connectivity, minimal capacitive loss, effectively suppress microwave and flux crosstalk and offer high freedom of coupling. Besides, by presenting a surface-13 tunable coupling superconducting quantum processor with median T1 reaching above 100 μs, the overall adaptability of tantalum airbridges is verified. The median single-qubit gate fidelity shows a tiny decrease from about 99.95% for the isolated Randomized Benchmarking to 99.94% for the simultaneous one. This fabrication method, compatible with all known superconducting materials, requires mild conditions of film deposition compared with the commonly used etching and grayscale lithography. Meanwhile, the experimental achievement of non-local coupling with controlled-Z (CZ) gate fidelity exceeding 99.2% may further facilitate qLDPC codes, laying a foundation for scalable quantum computation and quantum error correction with entirely tantalum elements.

Optimizing Resonator Frequency Stability in Flip-Chip Architectures: A Novel Experimental Design Approach

  1. Yuan Li,
  2. Tianhui Wang,
  3. Jingjing Hu,
  4. Dengfeng Li,
  5. and Shuoming An
In multi-qubit superconducting systems utilizing flip-chip technology, achieving high accuracy in resonator frequencies is of paramount importance, particularly when multiple resonators
share a common Purcell filter with restricted bandwidth. Nevertheless, variations in inter-chip spacing can considerably influence these frequencies. To tackle this issue, we present and experimentally validate the effectiveness of a resonator design. In our design, we etch portions of the metal on the bottom chip that faces the resonator structure on the top chip. This enhanced design substantially improves frequency stability by a factor of over 3.5 compared to the non-optimized design, as evaluated by the root mean square error of a linear fitting of the observed frequency distribution, which is intended to be linear. This advancement is crucial for successful scale-up and achievement of high-fidelity quantum operations.