We present a flip-chip-based sensing scheme to measure effective microwave losses associated with target materials for quantum technologies, without requiring any device fabricationon the material under test. Using this approach, we quantify the microwave losses of a strain-engineered Ge/SiGe quantum well heterostructure and investigate losses arising from its Ge substrate and intermediate layers. The quality factors of the fabricated microwave resonators agree with the losses of dielectric materials independently extracted from flip-chip sensing measurements. We further study the superconductor platinum silicon germanide (PtSiGe) prepared by thermal reaction with a deposited Pt film, finding high microwave losses that limit the suitability of the films studied here as the sole superconductor for high-quality resonator applications. By coating Pt with Nb prior to the reaction, we observe a substantial reduction in microwave loss and a nearly three-fold enhancement of the transport critical temperature. The temperature dependence of the microwave loss is consistent with gap inhomogeneity in both superconducting films. These results identify constraints on material choices, provide design guidance for microwave circuits on planar Ge heterostructures, and demonstrate a fast-turnaround testing method for new materials for superconducting quantum circuits.
Superconducting qubits based on tantalum (Ta) thin films have demonstrated the highest-performing microwave resonators and qubits. This makes Ta an attractive material for superconductingquantum computing applications, but, so far, direct deposition has largely relied on high substrate temperatures exceeding \SI{400}{\celsius} to achieve the body-centered cubic phase, BCC (\textalpha-Ta). This leads to compatibility issues for scalable fabrication leveraging standard semiconductor fabrication lines. Here, we show that changing the sputter gas from argon (Ar) to krypton (Kr) promotes BCC Ta synthesis on silicon (Si) at temperatures as low as \SI{200}{\celsius}, providing a wide process window compatible with back-end-of-the-line fabrication standards. Furthermore, we find these films to have substantially higher electronic conductivity, consistent with clean-limit superconductivity. We validated the microwave performance through coplanar waveguide resonator measurements, finding that films deposited at \SI{250}{\celsius} and \SI{350}{\celsius} exhibit a tight performance distribution at the state of the art. Higher temperature-grown films exhibit higher losses, in correlation with the degree of Ta/Si intermixing revealed by cross-sectional transmission electron microscopy. Finally, with these films, we demonstrate transmon qubits with a relatively compact, \SI{20}{\micro\meter} capacitor gap, achieving a median quality factor up to 14 million.
We report the structural and electronic properties of niobium nitride (NbN) thin films grown by molecular beam epitaxy on c-plane sapphire with miscut angles of 0.5o, 2o, 4o, and 10otowards m-axis. X-ray diffraction (XRD) scans reveal that the full width at half maximum of the rocking curves around the 1 1 1 reflection of these NbN films decreases with increasing miscut. Starting from 76 arcsecs on 0.5o miscut, the FWHM reduces to almost 20 arcsecs on 10o miscut sapphire indicating improved structural quality. Scanning transmission electron microscopy (STEM) images indicate that NbN on c-sapphire has around 10 nm critical thickness, irrespective of the substrate miscut, above which it turns columnar. The improved structural property is correlated with a marginal increment in superconducting transition temperature Tc from 12.1 K for NbN on 0.5o miscut sapphire to 12.5 K for NbN on 10o miscut sapphire.