Flip-Chip Packaging of Fluxonium Qubits

The strong anharmonicity and high coherence times inherent to fluxonium superconducting circuits are beneficial for implementing quantum information processors. In addition to requiring high-quality physical qubits, a quantum processor needs to be assembled in a manner that reduces crosstalk and decoherence. In this letter, we report work on fluxonium qubits packaged in a flip-chip architecture. Here, the fluxonium qubits are embedded in a multi-chip module (MCM), where a classical control and readout chip is bump-bonded to the quantum chip. The modular approach allows for improved connectivity between qubits and control/readout elements, and separate fabrication processes. We demonstrate that this configuration does not degrade the fluxonium qubit performance, and identify the main decoherence mechanisms to improve on the reported results.