Dielectric loss is one of the major decoherence sources of superconducting qubits. Contemporary high-coherence superconducting qubits are formed by material systems mostly consistingof superconducting films on substrate with low dielectric loss, where the loss mainly originates from the surfaces and interfaces. Among the multiple candidates for material systems, a combination of titanium nitride (TiN) film and sapphire substrate has good potential because of its chemical stability against oxidization, and high quality at interfaces. In this work, we report a TiN film deposited onto sapphire substrate achieving low dielectric loss at the material interface. Through the systematic characterizations of a series of transmon qubits fabricated with identical batches of TiN base layers, but different geometries of qubit shunting capacitors with various participation ratios of the material interface, we quantitatively extract the loss tangent value at the substrate-metal interface smaller than 8.9×10−4 in 1-nm disordered layer. By optimizing the interface participation ratio of the transmon qubit, we reproducibly achieve qubit lifetimes of up to 300 μs and quality factors approaching 8 million. We demonstrate that TiN film on sapphire substrate is an ideal material system for high-coherence superconducting qubits. Our analyses further suggest that the interface dielectric loss around the Josephson junction part of the circuit could be the dominant limitation of lifetimes for state-of-the-art transmon qubits.
Superconducting qubits provide a promising path toward building large-scale quantum computers. The simple and robust transmon qubit has been the leading platform, achieving multiplemilestones. However, fault-tolerant quantum computing calls for qubit operations at error rates significantly lower than those exhibited in the state of the art. Consequently, alternative superconducting qubits with better error protection have attracted increasing interest. Among them, fluxonium is a particularly promising candidate, featuring large anharmonicity and long coherence times. Here, we engineer a fluxonium-based quantum processor that integrates high qubit-coherence, fast frequency-tunability, and individual-qubit addressability for reset, readout, and gates. With simple and fast gate schemes, we achieve an average single-qubit gate fidelity of 99.97% and a two-qubit gate fidelity of up to 99.72%. This performance is comparable to the highest values reported in the literature of superconducting circuits. Thus our work, for the first time within the realm of superconducting qubits, reveals an approach toward fault-tolerant quantum computing that is alternative and competitive to the transmon system.
Titanium nitride is an attractive material for a range of superconducting quantum-circuit applications owing to its low microwave losses, high surface inductance, and chemical stability.The physical properties and device performance, nevertheless, depend strongly on the quality of the materials. Here we focus on the highly crystalline and epitaxial titanium nitride thin films deposited on sapphire substrates using magnetron sputtering at an intermediate temperature (300∘C). We perform a set of systematic and comprehensive material characterization to thoroughly understand the structural, chemical, and transport properties. Microwave losses at low temperatures are studied using patterned microwave resonators, where the best internal quality factor in the single-photon regime is measured to be 3.3×106, and >1.0×107 in the high-power regime. Adjusted with the material filling factor of the resonators, the microwave loss-tangent here compares well with the previously reported best values for superconducting resonators. This work lays the foundation of using epitaxial titanium nitride for low-loss superconducting quantum circuits.