Meter-scale quantum interconnects between large quantum processors

  1. Neereja M. Sundaresan,
  2. Nicholas Cotaj,
  3. Yadav Prasad Kandel,
  4. Eric Lewandowski,
  5. Christian Robert Longton,
  6. Yves Martin,
  7. Jae-woong Nah,
  8. Kathryn Pooley,
  9. Martin Sandberg,
  10. Michael Scanlon,
  11. Chi Xiong,
  12. Emanuil Sashev Yanev,
  13. David Abraham,
  14. Abhinandan Antony,
  15. Vincent Arena,
  16. Nicholas Bornman,
  17. Khanh Dang,
  18. Oliver Dial,
  19. Christopher Guarino,
  20. Gabriel Haspil,
  21. Jared Hertzberg,
  22. Kentaro Heya,
  23. Swetha Kamlapurkar,
  24. Michael Karschner,
  25. George Keefe,
  26. Eric Liniger,
  27. Laura Luo,
  28. Thomas G. McConkey,
  29. David Olson,
  30. Jason Orcutt,
  31. Dmitry Ovchinnikov,
  32. Timothy Phung,
  33. Sankeerth Rajalingam,
  34. Michael Selvanayagam,
  35. William Shanks,
  36. Dongbing Shao,
  37. Abigail Shearrow,
  38. Adam Stabile,
  39. Jiri Stehlik,
  40. Joseph Suttle,
  41. Jeng-Bang Yau,
  42. and Eric Zhang
Modular quantum architecture requires long-distance quantum interconnects to stitch together individual processor modules. Such interconnects, long-distance couplers or L-couplers,
must support coherent quantum operation over meter-scale distances and scale to multiple connections between any two modules. Here we demonstrate four L-couplers operating between two 120-qubit IBM Nighthawk R1 superconducting qubit processors. Each L-coupler joins two Nighthawk lattice qubits through two frequency-tunable L-qubits, two RF-SQUID based „i2m“ couplers, and 80 cm of superconducting aluminum coax. Each cable installs perpendicular to the processor surface, to enable denser connections, and is joined to the chip by an indium-to-indium room temperature pressure bond made after both modules were mounted. L-coupler modes near 5 GHz, with internal quality factors of 0.86 to 1.09e6, carry relay-based state transfer at a mean network benchmarking fidelity of 99.00%, with a best link of 99.29 +/- 0.07%. We then realize distant CZ gates between lattice qubits in separate modules at a mean fidelity of 94.75%, with a best link of 96.42 +/- 0.28%, and use them to generate entangled states across the two processors, including a demonstration of simultaneous Bell pair generation using two adjacent L-couplers. These four high-fidelity L-couplers establish a practical path to scalable quantum interconnects for modular quantum computing.

Randomized benchmarking of a high-fidelity remote CNOT gate over a meter-scale microwave interconnect

  1. Kentaro Heya,
  2. Timothy Phung,
  3. Moein Malekakhlagh,
  4. Rachel Steiner,
  5. Marco Turchetti,
  6. William Shanks,
  7. John Mamin,
  8. Wen-Sen Lu,
  9. Yadav Prasad Kandel,
  10. Neereja Sundaresan,
  11. and Jason Orcutt
In the modular superconducting quantum processor architecture, high-fidelity, meter-scale microwave interconnect between processor modules is a key technology for extending system size
beyond constraints imposed by device manufacturing equipment, yield, and signal delivery. While there have been many demonstrations of remote state transfer between modules, these relied on tomographic experiments for benchmarking, but this technique does not reliably separate State Preparation And Measurement (SPAM) error from error per state transfer. Recent developments based on randomized benchmarking provide a compatible theory for separating these two errors. In this work, we present a module-to-module interconnect based on Tunable-Coupling Qubits (TCQs) and benchmark, in a SPAM error tolerant manner, a remote state transfer fidelity of 0.988 across a 60cm long coplanar waveguide (CPW). The state transfer is implemented via superadiabatic transitionless driving method, which suppresses intermediate excitation in internal modes of CPW. We also introduce the frame tracking technique to correct unintended qubit phase rotations before and after the state transfers, which enables the SPAM-error-tolerant benchmarking of the state transfers. We further propose and construct a remote CNOT gate between modules, composed of local CZ gates in each module and remote state transfers, and report a high gate fidelity of 0.933 using randomized benchmarking method. The remote CNOT construction and benchmarking we present is a more complete metric that fully characterizes the module to module link operation going forward as it more closely represents interconnect operation in a circuit.