High Coherence Plane Breaking Packaging for Superconducting Qubits

  1. Nicholas T. Bronn,
  2. Vivekananda P. Adiga,
  3. Salvatore B. Olivadese,
  4. Xian Wu,
  5. Jerry M. Chow,
  6. and David P. Pappas
We demonstrate a pogo pin package for a superconducting quantum processor specifically designed with a nontrivial layout topology (e.g., a center qubit that cannot be accessed from
the sides of the chip). Two experiments on two nominally identical superconducting quantum processors in pogo packages, which use commercially available parts and require modest machining tolerances, are performed at low temperature (10 mK) in a dilution refrigerator and both found to behave comparably to processors in standard planar packages with wirebonds where control and readout signals come in from the edges. Single- and two-qubit gate errors are also characterized via randomized benchmarking. More detailed crosstalk measurements indicate levels of crosstalk less than -40 dB at the qubit frequencies, opening the possibility of integration with extensible qubit architectures.