We present a device demonstrating a lithographically patterned transmon integrated with a micromachined cavity resonator. Our two-cavity, one-qubit device is a multilayer microwaveintegrated quantum circuit (MMIQC), comprising a basic unit capable of performing circuit-QED (cQED) operations. We describe the qubit-cavity coupling mechanism of a specialized geometry using an electric field picture and a circuit model, and finally obtain specific system parameters using simulations. Fabrication of the MMIQC includes lithography, etching, and metallic bonding of silicon wafers. Superconducting wafer bonding is a critical capability that is demonstrated by a micromachined storage cavity lifetime 34.3 μs, corresponding to a quality factor of 2 million at single-photon energies. The transmon coherence times are T1=6.4 μs, and TEcho2=11.7 μs. We measure qubit-cavity dispersive coupling with rate χqμ/2π=−1.17 MHz, constituting a Jaynes-Cummings system with an interaction strength g/2π=49 MHz. With these parameters we are able to demonstrate cQED operations in the strong dispersive regime with ease. Finally, we highlight several improvements and anticipated extensions of the technology to complex MMIQCs.
We present a method for relieving aluminum 3D transmon qubits from a silicon substrate using micromachining. Our technique is a high yield, one-step deep reactive ion etch that requiresno additional fabrication processes, and results in the suspension of the junction area and edges of the aluminum film. The drastic change in the device geometry affects both the dielectric and flux noise environment experienced by the qubit. In particular, the participation ratios of various dielectric interfaces are significantly modified, and suspended qubits exhibited longer T1’s than non-suspended ones. We also find that suspension increases the flux noise experienced by tunable SQUID-based qubits.
As experimental quantum information processing (QIP) rapidly advances, an emerging challenge is to design a scalable architecture that combines various quantum elements into a complexdevice without compromising their performance. In particular, superconducting quantum circuits have successfully demonstrated many of the requirements for quantum computing, including coherence levels that approach the thresholds for scaling. However, it remains challenging to couple a large number of circuit components through controllable channels while suppressing any other interactions. We propose a hardware platform intended to address these challenges, which combines the advantages of integrated circuit fabrication and long coherence times achievable in three-dimensional circuit quantum electrodynamics (3D cQED). This multilayer microwave integrated quantum circuit (MMIQC) platform provides a path toward the realization of increasingly complex superconducting devices in pursuit of a scalable quantum computer.
Superconducting enclosures will be key components of scalable quantum computing devices based on circuit quantum electrodynamics (cQED). Within a densely integrated device, they canprotect qubits from noise and serve as quantum memory units. Whether constructed by machining bulk pieces of metal or microfabricating wafers, 3D enclosures are typically assembled from two or more parts. The resulting seams potentially dissipate crossing currents and limit performance. In this Letter, we present measured quality factors of superconducting cavity resonators of several materials, dimensions and seam locations. We observe that superconducting indium can be a low-loss RF conductor and form low-loss seams. Leveraging this, we create a superconducting micromachined resonator with indium that has a quality factor of two million despite a greatly reduced mode volume. Inter-layer coupling to this type of resonator is achieved by an aperture located under a planar transmission line. The described techniques demonstrate a proof-of-principle for multilayer microwave integrated quantum circuits for scalable quantum computing.