bridges (AB) are commonly used to electrically connect ground planes together when interrupted by transmission lines. Here, we demonstrate the use of two-photon photolithography to build a supporting 3D resist structure in conjunction with a lift-off process to create AB. The resulting aluminum AB, have a superconducting transition temperature Tc=1.08 K and exhibit good mechanical strength up to lengths of 100 μm. A measurable amount of microwave loss is observed when 35 AB were placed over a high-Q Ta quarter-wave coplanar waveguide resonator.