the footprint and the parasitic cross-coupling and is ultimately limited by radiation losses – a potential roadblock for scaling up quantum processors to millions of qubits. In this work we present transmon qubits with sizes as low as 36×39μm2 with ≳100\,nm wide vacuum gap capacitors that are micro-machined from commercial silicon-on-insulator wafers and shadow evaporated with aluminum. After the release in HF vapor we achieve a vacuum participation ratio up to 99.6\% in an in-plane design that is compatible with standard coplanar circuits. Qubit relaxation time measurements for small gaps with high vacuum electric fields of up to 22\,V/m reveal a double exponential decay indicating comparably strong coupling to long-lived two-level-systems (TLS). %We also show that the fast ‚initial‘ and slow ‚residual‘ decay strongly correlates with the measured sub-single-photon and high-drive-power quality factors of lumped element vacuum gap resonators, respectively. The exceptionally high selectivity of >20\,dB to the superconductor-vacuum surface allows to precisely back out the sub-single-photon dielectric loss tangent of aluminum oxide exposed to ambient conditions of tanδ=1.5×10−4 for a thickness of 3\,nm. %assuming 3\,nm thick. %the widely used aluminum oxide exposed to ambient conditions. In terms of future scaling potential we achieve a qubit quality factor by footprint area of 20μs−2, which is on par with the highest T1 devices relying on larger geometries and expected to improve substantially for lower loss superconductors like NbTiN, TiN or Ta.
Compact vacuum gap transmon qubits: Selective and sensitive probes for superconductor surface losses
State-of-the-art transmon qubits rely on large capacitors which systematically improves their coherence due to reduced surface loss participation. However, this approach increases both