Low crosstalk modular flip-chip architecture for coupled superconducting qubits

  1. Sören Ihssen,
  2. Simon Geisert,
  3. Gabriel Jauma,
  4. Patrick Winkel,
  5. Martin Spiecker,
  6. Nicolas Zapata,
  7. Nicolas Gosling,
  8. Patrick Paluch,
  9. Manuel Pino,
  10. Thomas Reisinger,
  11. Wolfgang Wernsdorfer,
  12. Juan Jose Garcia-Ripoll,
  13. and Ioan M. Pop
We present a flip-chip architecture for an array of coupled superconducting qubits, in which circuit components reside inside individual microwave enclosures. In contrast to other flip-chip approaches, the qubit chips in our architecture are electrically floating, which guarantees a simple, fully modular assembly of capacitively coupled circuit components such as qubit, control, and coupling structures, as well as reduced crosstalk between the components. We validate the concept with a chain of three nearest neighbor coupled generalized flux qubits in which the center qubit acts as a frequency-tunable coupler. Using this coupler, we demonstrate a transverse coupling on/off ratio ≈ 50, zz-crosstalk ≈ 0.7 kHz between resonant qubits and isolation between the qubit enclosures > 60 dB.
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