Quantum processors require a signal-delivery architecture with high addressability (low crosstalk) to ensure high performance already at the scale of dozens of qubits. Signal crosstalkcauses inadvertent driving of quantum gates, which will adversely affect quantum-gate fidelities in scaled-up devices. Here, we demonstrate packaged flip-chip superconducting quantum processors with signal-crosstalk performance competitive with those reported in other platforms. For capacitively coupled qubit-drive lines, we find on-resonant crosstalk better than -27 dB (average -37 dB). For inductively coupled magnetic-flux-drive lines, we find less than 0.13 % direct-current flux crosstalk (average 0.05 %). These observed crosstalk levels are adequately small and indicate a decreasing trend with increasing distance, which is promising for further scaling up to larger numbers of qubits. We discuss the implication of our results for the design of a low-crosstalk, on-chip signal delivery architecture, including the influence of a shielding tunnel structure, potential sources of crosstalk, and estimation of crosstalk-induced qubit-gate error in scaled-up quantum processors.
We investigate the required embedding networks to enable ideal performance for a high-gain travelling-wave parametric amplifier (TWPA) based on three-wave mixing (3WM). By embeddingthe TWPA in a network of superconducting diplexers and hybrid couplers, the amplifier can deliver a high stable gain with near-quantum-limited noise performance, with suppressed gain ripples, while eliminating the reflections of the signal, the idler and the pump as well as the transmission of all unwanted tones. We demonstrate a configuration where the amplifier can isolate. We call this technique Wideband Idler Filtering (WIF). The theory is supported by simulations that predict over 20 dB gain in the band 4-8 GHz with 10 dB isolation for a single amplifier and 30 dB isolation for two cascaded amplifiers. We demonstrate how the WIF-TWPAs can be used to construct switchable isolators with over 40 dB isolation over the full band 4-8 GHz. We also propose an alternative design where the WIF can be implemented without diplexers. Finally we show how, with small modifications, the technique can be implemented for four-wave mixing (4WM) TWPAs as well.
In superconducting quantum processors, the predictability of device parameters is of increasing importance as many labs scale up their systems to larger sizes in a 3D-integrated architecture.In particular, the properties of superconducting resonators must be controlled well to ensure high-fidelity multiplexed readout of qubits. Here we present a method, based on conformal mapping techniques, to predict a resonator’s parameters directly from its 2D cross-section, without computationally heavy simulation. We demonstrate the method’s validity by comparing the calculated resonator frequency and coupling quality factor with those obtained through 3D finite-element-method simulation and by measurement of 15 resonators in a flip-chip-integrated architecture. We achieve a discrepancy of less than 2% between designed and measured frequencies, for 6-GHz resonators. We also propose a design method that reduces the sensitivity of the resonant frequency to variations in the inter-chip spacing.
We report the implementation of a near-quantum-limited, traveling-wave parametric amplifier that uses three-wave mixing (3WM). To favor amplification by 3WM, we use the superconductingnonlinear asymmetric inductive element (SNAIL) loops, biased with a dc magnetic flux. In addition, we equip the device with dispersion engineering features to create a stop-band at the second harmonic of the pump and suppress the propagation of the higher harmonics that otherwise degrade the amplification. With a chain of 440 SNAILs, the amplifier provides up to 20 dB gain and a 3-dB bandwidth of 1 GHz. The added noise by the amplifier is found to be less than one photon.
We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips – one quantum chip and one control chip –that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90μs, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.
Present-day, noisy, small or intermediate-scale quantum processors—although far from fault-tolerant—support the execution of heuristic quantum algorithms, which might enablea quantum advantage, for example, when applied to combinatorial optimization problems. On small-scale quantum processors, validations of such algorithms serve as important technology demonstrators. We implement the quantum approximate optimization algorithm (QAOA) on our hardware platform, consisting of two transmon qubits and one parametrically modulated coupler. We solve small instances of the NP-complete exact-cover problem, with 96.6\% success probability, by iterating the algorithm up to level two.